DELO offers epoxy adhesives from the DELO KATIOBOND family. These adhesives are both light- and dual-curing (light and heat) and exhibit high resistance to laser beams, low and controllable shrinkage, low outgassing and maintain precision performance over their entire lifetime. In active alignment processes, optical components can be fixed in one to five seconds, enabling efficient processing with shorter production cycle times.
Ideal for CIPG & FIPG
Adhesives from the DELO PHOTOBOND family are well-suited for the optimal housing sealing of laser systems. They can be used for applications such as Cured in Place Gasket (CIPG) for reliable seals or Formed in Place Gasket (FIPG) for the secure fastening and sealing of the housing sealing.
DELO showcased these adhesive solutions, as well as other new high-tech solutions for laser assembly at the China International Optoelectronic Exposure (CIOE) 2025 in Shenzhen, September 10-12, in Hall 1, Stand 1A83.
Explore practical ways epoxy resins enhance performance, stability, and application possibilities in adhesives and sealants.
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