Adhesive of photosensitive epoxy resin composition for gypsum material 3D printing and preparation method thereof 

Inventor(s)（發明人）: ZHANG JUN; YANG JIQUAN; CHENG CHUHAN; GUO XIAOQING; ZHU XIAOQIAN; CHEN SIQI; WU YIQIN

Priority number(s)（專利檢索號）: CN2016171421 20160201

Abstract of  CN105694791 (A)：

The invention discloses an adhesive of a photosensitive epoxy resin composition for gypsum material 3D printing and a preparation method thereof. An epoxy acrylate resin is used as a binding resin, benzoic acid and derivatives thereof are used as a photoinitiator, isobutanol is used as a flow permeation accelerator, an ultraviolet light source is used as an initiation light source, thereby preparing the high-efficiency adhesive for gypsum material 3D printing. The method effectively overcomes the defects of low initial strength, low printing speed, high after-treatment difficulty and the like in the product when the existing gypsum and other inorganic materials use the common 3D printing technique. The method can effectively enhance the printing speed and initial strength of the 3D printing gypsum product, and avoids the complicated after-treatment technique for the printing product, thereby greatly enhancing the manufacturing efficiency of the 3D printing product and the quality of the finished product, and lowering the technical complexity.