Flexible conductive adhesive based on modified epoxy resin  

（一種基于改性環氧樹脂的柔韌性導電膠黏劑）

Inventor(s): WANG XIAODONG

Priority number(s)(專利檢索號): CN20141615420 20141105

Abstract of  CN105623579 (A)：

The invention discloses a flexible conductive adhesive based on modified epoxy resin. The flexible conductive adhesive comprises the following components by mass percentage: 15-30% of modified epoxy resin, 40-60% of nano silver powder, 5-8% of tin oxide, 5-8% of magnesium oxide, 3-6% of a flexible additive, 0-2% of toluene, 2-4% of silica gel, 0.5-1.5% of a coupling agent, and 0.5-1.5% of a curing agent. By adding the flexible additive, the flexibility of a conductive adhesive matrix is increased, and mechanical property is increased, network density formed by the flexible additive and epoxy resin is suitable for current conduction, so that the flexibility of the conductive adhesive is increased, at the same time, resistivity of the conductive adhesive is reduced. The flexibility of the conductive adhesive solves the problem of cracking of a substrate and an element in packaging, and the conductive adhesive is especially suitable for an electronic packaging technology in microelectronic industry.