MODIFIED PHENOLIC RESOLE RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND ADHESIVE  

Inventor(s)（發明人）: MIFUKA HAJIME [JP] +

Application number（歐洲專利申請號）: WO2016JP60632 20160331 

Abstract of  WO2016159218 (A1)：

The present invention provides a modified phenolic resole resin composition including a modified phenolic resole resin that has structural units A, which are represented by general formula (1) and are modified using a dimethylphenol, and structural units B, which are represented by general formula (2). (In formula (1), m is an integer of 1 or greater. When m is 1, R is a methylol group. When m is 2 or greater, R independently are a hydrogen atom or methylol group, and at least one R is a methylol group) (In formula (2), n is an integer of 1 or greater. When n is 1, R is a methylol group. When n is 2 or greater, R independently are a hydrogen atom or methylol group, and at least one R is a methylol group).